Senior Wafer Bonding & Packaging Architect

thrively; Santa Clara (CA); On-site; USD 180,000 - 280,000; Full time

Job summary

Thrively is seeking a Principal Wafer Bonding Integration & Packaging Engineer to own advanced wafer bonding, process integration, packaging development, and manufacturing transfer.

You will collaborate with internal teams and external foundries to deliver manufacturable, scalable bonding solutions and drive yield improvements, DOE-driven process characterization, and transition of technologies into production.

Qualifications

• BS, MS, or PhD in Materials Science, Mechanical/Electrical Engineering, Physics, or related field.
• 10+ years of semiconductor product development and packaging experience.
• Hands-on bonding technologies: fusion, eutectic, hybrid, direct bonding.

Responsibilities

• Own bonding integration strategy from development to manufacturing ramp.
• Define bonding windows, alignment, thermal budgets, and material compatibility.
• Lead process transfers and qualification activities with external foundries.
• Drive yield improvements through DOE, SPC, and root-cause analysis.

Skills

Wafer bonding

Process integration

Yield improvement

DOE & SPC

Education

BS in Materials Science / related

MS/PhD in related field

Tools

SEM

IR inspection

Profilometry

C-SAM

AFM

Job description

Thrively is seeking a Principal Wafer Bonding Integration & Packaging Engineer to own advanced wafer bonding, process integration, packaging development, and manufacturing transfer.

You will collaborate with internal teams and external foundries to deliver manufacturable, scalable bonding solutions and drive yield improvements, DOE-driven process characterization, and transition of technologies into production.