Senior Wafer Bonding & MEMS Integration Engineer

Energy Jobline ZR; Santa Clara (CA); On-site; USD 160,000 - 210,000; Full time

Job summary

nEye.ai is seeking a Wafer Bonding Integration Engineer to lead advanced wafer bonding development and manufacturing transfer for next-gen optical switching products. You will partner with design teams and external foundries to deliver robust bonding solutions for high-volume production.

The role requires deep expertise in fusion, eutectic, hybrid, and direct bonding, with experience in MEMS or silicon photonics and strong manufacturing integration skills.

Qualifications

• BS, MS, or PhD in Materials Science, Mechanical Eng., Electrical Eng., Physics, MEMS or related field.
• 10+ years in new product introduction with wafer process integration and manufacturing.
• Hands-on with advanced wafer bonding technologies: Fusion, Eutectic, Hybrid, Direct Bonding.

Responsibilities

• Own wafer bonding integration strategy through development to high-volume manufacturing.
• Collaborate with design, process development, and foundries to create robust manufacturing flows.
• Lead transfer activities to ensure manufacturability and repeatability across partners.
• Interface between nEye engineering and external fabrication partners during NPI.
• Drive process readiness, meeting schedule, yield, quality, and reliability goals.

Skills

Wafer bonding

Process integration

Manufacturing transfer

Statistical analysis

Root cause analysis

DOE

SPC

Cross-functional collaboration

TSE experience

Education

BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS

Tools

SEM

IR inspection

Profilometry

C-SAM

AFM

Job description

nEye.ai is seeking a Wafer Bonding Integration Engineer to lead advanced wafer bonding development and manufacturing transfer for next-gen optical switching products. You will partner with design teams and external foundries to deliver robust bonding solutions for high-volume production.

The role requires deep expertise in fusion, eutectic, hybrid, and direct bonding, with experience in MEMS or silicon photonics and strong manufacturing integration skills.