Senior Wafer Bonding Integration Engineer — MEMS & Photonics

nEye Systems, Inc.

Santa Clara, Northern (CA, KY)

Hybrid

USD 160,000 - 220,000

Full time

14 days+

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Job summary

nEye Systems, Inc. is seeking a Wafer Bonding Integration Engineer to lead development, integration, and manufacturing transfer of advanced wafer bonding processes for next-generation optical switching products.

You will partner with design teams and external foundries to create robust bonding solutions, drive NPI, and enable volume manufacturing with a strong emphasis on yield, reliability, and process control.

Qualifications

BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS, or a related technical discipline.
10+ years of experience in new product introduction with ownership in wafer process integration, advanced packaging, CMOS manufacturing.
Hands-on experience with advanced wafer bonding technologies including Fusion, Eutectic, Hybrid, and Direct Bonding.
Experience with TSV integration, wafer thinning, cavity SOI, or 3D integration technologies.

Responsibilities

Own wafer bonding integration strategy from early product development through high-volume manufacturing.
Lead process transfer activities and ensure manufacturable, repeatable bonding solutions across multiple foundry partners.
Drive process readiness for new product introductions, ensuring schedule, yield, quality, and reliability objectives are achieved.
Collaborate with packaging and process integration teams on bonded wafer architectures.
Coordinate engineering experiments and process characterization across multiple manufacturing partners.