Quantum 3D Integration Engineer (Bonding & Packaging)

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D bonding integration engineer for our Quantum Advanced Packaging team in the US. You will focus on 3DHI development, including wafer-to-wafer and die-to-wafer bonding, and work to advance 2.5D/3D integration strategies.

As a new member of the Quantum Advanced Packaging group, you will drive process development, collaborate with OSAT partners, and build expertise in materials and tooling while seeking yield improvements and cost reductions.

Qualifications

• Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Internship or co-op experience.
• Overall GPA of 3.0 or higher.
• English language fluency (written & verbal).
• Travel up to 10%.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers for Quantum Advanced Packaging projects.
• Collaborate with OSATs to develop wafer-level and die-level 2.5D/3D heterogeneous integration processes.
• Develop expertise in processes, materials, and tooling; leverage characterization resources.
• Drive mechanistic understanding of failure modes.
• Develop integration schemes to continuously improve yields and reduce cycle time and costs.
• Generate IP related to novel wafer integration and packaging technology.
• Work with other teams on assignments as needed.

Skills

Project management

Leadership experience

Communication skills

Planning and organizational skills

Navigate ambiguity

Education

Bachelor’s or Master’s in Electrical/Mechanical/Chemical/Materials Science or related field

PhD preferred

Job description

GlobalFoundries is seeking a motivated R&D bonding integration engineer for our Quantum Advanced Packaging team in the US. You will focus on 3DHI development, including wafer-to-wafer and die-to-wafer bonding, and work to advance 2.5D/3D integration strategies.

As a new member of the Quantum Advanced Packaging group, you will drive process development, collaborate with OSAT partners, and build expertise in materials and tooling while seeking yield improvements and cost reductions.