Senior 3D-HI Packaging Engineer

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and wafer-to-wafer integration while partnering with process and manufacturing teams.

You will guide project teams, analyze data, and address failure modes to enable new capabilities and early prototyping across programs in a large-scale semiconductor environment.

Qualifications

• Master’s degree in a relevant engineering field with 4–5 years of related experience.
• Deep knowledge of BEOL processes and integration, advanced bonding, TSVs, and wafer/ die finish.
• Strong problem solving and DOE skills; good academic standing and English fluency.

Responsibilities

• Lead 3D-HI process development for multi-die stacking and bonding.
• Collaborate with unit process engineers, manufacturing engineers, and vendors.
• Drive end-to-end process integration for prototyping across programs.
• Develop expertise in materials and tooling and manage characterization resources.
• Identify and resolve process integration issues and generate IP.

Skills

BEOL processes

3D integration

DOE

English proficiency

Problem solving

Education

Master's degree (Electrical/Mechanical/Chemical/Materials)

PhD preferred

Tools

Characterization tools

Data analysis

Failure analysis

Job description

GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and wafer-to-wafer integration while partnering with process and manufacturing teams.

You will guide project teams, analyze data, and address failure modes to enable new capabilities and early prototyping across programs in a large-scale semiconductor environment.