Senior Package Thermal Modeling Architect

Advanced Micro Devices; Austin (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

Advanced Micro Devices in Austin, TX is seeking a skilled Advanced Package Thermal Technologist to drive model-based architecture for next-generation packaging platforms. You will develop and validate thermal models guiding SoC, package, and board-level decisions and collaborate with silicon, package, and system teams.

Ideal candidates have MS/PhD in engineering or physics, with strong thermal/cfd expertise and experience in multi-physics design and experimental validation for data center

Qualifications

• MS or PhD in relevant engineering disciplines or physics.
• Experience in model-based architecture decisions for SoC/package/system-level designs.
• Strong understanding of thermal modeling, CFD, and multi-physics trade-offs.

Responsibilities

• Drive model-based architecture and design decisions for advanced package technologies.
• Develop and maintain thermal and multi-physics models and validation strategies.
• Engage with suppliers and vendors to align materials, processes, and modeling assumptions.
• Define targets and strategic direction for thermal and package technology development.
• Serve as a thermal subject-matter expert for data center platforms.

Skills

Thermal modeling

Model-based design

CFD

Multi-physics

PCB technologies

Electro-thermal

Electro-optical

AI/ML workflows

System architecture

DOE design

Education

MS or PhD in engineering or physics

Tools

ANSYS

COMSOL Multiphysics

MATLAB/Simulink

Thermal testing labs

Job description

Advanced Micro Devices in Austin, TX is seeking a skilled Advanced Package Thermal Technologist to drive model-based architecture for next-generation packaging platforms. You will develop and validate thermal models guiding SoC, package, and board-level decisions and collaborate with silicon, package, and system teams.

Ideal candidates have MS/PhD in engineering or physics, with strong thermal/cfd expertise and experience in multi-physics design and experimental validation for data center