Thermal Engineer, Advanced Packaging & NPI

AMD

Austin (TX)

Vor Ort

USD 110.000 - 170.000

Vollzeit

14 Tage+

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Zusammenfassung

AMD is seeking a Thermal Engineer to drive thermal characterization and technology development for advanced packaging and NPI programs. You will collaborate with design, reliability, manufacturing, test, and product engineering to evaluate thermal performance and enable successful product ramps.

The ideal candidate is hands-on, analytical, and thrives in fast-paced development environments, delivering robust thermal solutions from concept through production.

Qualifikationen

Hands-on thermal engineering in electronics, semiconductors, or packaging.
Strong understanding of heat transfer and thermal management.
Experience with Thermal Test Vehicles (TTVs) and lab testing.
Familiarity with thermal modeling and data analysis.
Experience with NPI, qualification, manufacturing, and OSAT engagements.

Aufgaben

Serve as thermal SME for advanced packaging and NPI programs.
Lead thermal characterization, TTV development, testing and data analysis.
Develop thermal models and correlate with measurements.
Collaborate with cross-functional teams to assess thermal performance.
Support qualification, production ramp, and OSAT engagements.
Investigate issues, perform root-cause analysis, drive corrective actions.
Contribute to future technology direction and process improvements.

Kenntnisse

Thermal engineering

Semiconductor

Data center experience

Thermal testing

Modeling & simulation

Ausbildung

Bachelor's degree

Advanced degree (plus)

Jobbeschreibung