Thermal Engineer - Advanced Packaging & NPI | Hybrid

Advanced Micro Devices, Inc.

Austin (TX)

Hybrid

USD 100,000 - 140,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Advanced Micro Devices, Inc. is seeking a Thermal Engineer to drive thermal characterization, validation, and technology development for cutting‑edge package architectures and next‑generation products.

You will collaborate with design, reliability, manufacturing, test, and product teams to evaluate performance and enable successful ramps. The role offers opportunities to develop innovative test methodologies, influence packaging technologies, and work with global engineering teams to solve

Qualifications

Bachelor’s degree in Mechanical Engineering or related field.
Experience in thermal engineering within semiconductor/electronics packaging.
Strong heat transfer knowledge and thermal management.
Experience with Thermal Test Vehicles (TTVs) and lab testing.
Strong analytical and collaboration skills.

Responsibilities

Serve as thermal SME for advanced packaging and NPI.
Lead thermal characterization, including TTV development, testing, data analysis, and validation.
Develop thermal models and correlate simulation results with measurements.
Partner with cross-functional teams to assess thermal performance, identify risks, and implement solutions.
Support qualification, product bring-up, manufacturing transfers, and OSAT engagements.
Investigate thermal issues, perform root-causes, and drive corrective actions.
Contribute to future technology pathfinding and continuous improvement of thermal methodologies.