Senior Thermal Simulation Engineer - Advanced Packaging

Samsung Semiconductor Inc.; San Jose (CA); On-site; USD 189,000 - 301,000; Full time

Job summary

Samsung Semiconductor Inc. in San Jose seeks a highly experienced Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies.

The role collaborates with customers and internal teams to translate requirements into robust simulations and optimized designs. You will apply CFD tools like ANSYS Icepak, Flotherm, and CELSIUS, influence packaging architectures, and drive reliability through detailed modeling and

Qualifications

• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.
• Experience in CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation.
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
• Fundamental understanding of IC chip/package architectures and thermal design constraints.
• Working experience in SiP (System in Package) thermal analysis.
• Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
• You're inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Responsibilities

• Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
• Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.
• Influence the architecture and/or design, materials selection, and structural integrity of high-performance advanced packaging under manufacturing, test, and usage conditions.
• Analyze simulation and measurement results to enhance product reliability.
• Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
• Translate customer requirements and thermal specifications into simulation methodologies.
• Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
• Communicate technical findings clearly through engineering reports, presentations and customer reviews.
• Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.

Skills

Heat transfer

Fluid mechanics

Electronics cooling

SiP thermal analysis

Cross-functional collaboration

Technical communication

Education

PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science

Tools

AN SYS Icepak

Flotherm

CELSIUS

Job description

Samsung Semiconductor Inc. in San Jose seeks a highly experienced Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies.

The role collaborates with customers and internal teams to translate requirements into robust simulations and optimized designs. You will apply CFD tools like ANSYS Icepak, Flotherm, and CELSIUS, influence packaging architectures, and drive reliability through detailed modeling and