Senior Thermal & Mechanical Packaging Leader

Annapurna Labs; Austin (TX); On-site; USD 154,000 - 215,000; Full time

Job summary

Annapurna Labs in USA, Texas, Austin is seeking a Thermal & Mechanical Packaging Engineer to lead design and optimization of packaging for high-performance computing infrastructure. You will drive from circuit-level concepts to high-volume manufacturing, shaping hardware used in our data centers and impacting millions of users.

The role emphasizes collaboration across disciplines, advanced modeling and hands-on testing to validate designs, with a focus on reliability, cost efficiency, and

Qualifications

• Master's degree in mechanical engineering or equivalent.
• 3+ years industry experience in advanced packaging of semiconductors.
• Experience designing and testing test vehicles to assess future packaging architectures.

Responsibilities

• Design and build thermal and mechanical packaging systems for large-scale data center hardware and optimize for quality, performance and cost.

Skills

Customer communication

Mechanical design

Packaging design

Thermal modeling

Cross-functional collaboration

Education

Master's degree in mechanical engineering

Tools

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Job description

Annapurna Labs in USA, Texas, Austin is seeking a Thermal & Mechanical Packaging Engineer to lead design and optimization of packaging for high-performance computing infrastructure. You will drive from circuit-level concepts to high-volume manufacturing, shaping hardware used in our data centers and impacting millions of users.

The role emphasizes collaboration across disciplines, advanced modeling and hands-on testing to validate designs, with a focus on reliability, cost efficiency, and