Cloud Thermal/Mechanical Engineer – ML/AI Accelerators

Amazon Web Services (AWS); Seattle (WA); On-site; USD 159,000 - 215,000; Full time

Job summary

Annapurna Labs, an AWS organization, is seeking an experienced Cloud Hardware Development Engineer (Thermal/Mechanical) to own end-to-end thermal and mechanical design for ML/AI accelerator platforms. You will drive platform-level packaging, cooling, and reliability across production lifecycles in a fast-paced, ambiguity-prone environment.

Join a cross-functional team collaborating with silicon, firmware, manufacturing, and operations to deliver scalable systems powering AWS ML/AI services

Qualifications

• BS degree in mechanical engineering or equivalent.
• 7+ years in mechanical and thermal design for electronics packaging.
• 3+ years in SoC thermal modelling and IC package transient thermal response.
• Experience with chip package, system mechanical & thermal design for air- and liquid-cooled systems.
• Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined components.
• Experience with production fleet support: telemetry analysis and root cause analysis.
• Leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations.

Responsibilities

• Own the complete thermal and mechanical design for ML/AI accelerator platforms—from rack-level to chip packaging.
• Define design requirements and drive cross-functional alignment across hardware, firmware and software.
• Deliver production platforms through concept, design, validation, and fleet operations.
• Design cooling solutions and develop models and analyses (CFD/FEA) for high-power ML/AI accelerators.
• Lead design reviews, mentor engineers, and influence packaging decisions and validation methods.

Skills

Mechanical design

Thermal design

CFD modeling

FEA analysis

GD&T

Chilled water systems

Vendor management

Cross-functional leadership

Education

BS in mechanical engineering

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

Solidworks

ASME Y14.5 (GD&T)

3D CAD

Linux

Python

Job description

Annapurna Labs, an AWS organization, is seeking an experienced Cloud Hardware Development Engineer (Thermal/Mechanical) to own end-to-end thermal and mechanical design for ML/AI accelerator platforms. You will drive platform-level packaging, cooling, and reliability across production lifecycles in a fast-paced, ambiguity-prone environment.

Join a cross-functional team collaborating with silicon, firmware, manufacturing, and operations to deliver scalable systems powering AWS ML/AI services