Senior Mechanical Engineer - ML/AI Thermal Systems

Amazon Web Services (AWS); Austin (TX); On-site; USD 159,000 - 215,000; Full time

Job summary

Annapurna Labs (U.S.) Inc. seeks a Cloud Hardware Development Engineer (Thermal/Mechanical) to own end-to- end thermal and mechanical design for ML/AI accelerator platforms, from rack-level infrastructure to chip packaging.

You will design cooling solutions, run CFD/FEA analyses, and lead cross-functional teams across silicon, firmware, manufacturing, and operations to deliver reliable, scalable systems for AWS ML/AI services.

Qualifications

• BS degree in mechanical engineering or equivalent.
• 7+ years industry experience in mechanical and thermal design in electronics packaging.
• 3+ years of experience in SoC thermal modelling and IC package transient thermal response.
• Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems.
• Experience with tolerance analysis (GD&T) and sheet metal or precision-machined component design for electronics packaging.
• Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies.
• Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams.

Responsibilities

• Own the complete thermal and mechanical design for ML/AI accelerator platforms — from rack-level infrastructure down to chip packaging.
• Define thermal and mechanical design requirements, establish design targets, and drive cross-functional alignment across hardware, firmware, and software teams.
• Deliver production platforms through the full lifecycle: concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations.
• Design and optimize cooling solutions (air and liquid) for high-power-density ML/AI accelerators.
• Develop CFD models, RC models, and structural FEA for thermal analysis and mechanical integrity.
• Own mechanical design of high-density interconnects including cable cartridges, backplane connectors, and mating interfaces.

Skills

Mechanical design

Thermal design

SoC thermal modelling

GD&T

FEM/FEA

Thermal measurements

Cross-functional leadership

Production fleet support

Education

BS in mechanical engineering

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

Solidworks

Job description

Annapurna Labs (U.S.) Inc. seeks a Cloud Hardware Development Engineer (Thermal/Mechanical) to own end-to- end thermal and mechanical design for ML/AI accelerator platforms, from rack-level infrastructure to chip packaging.

You will design cooling solutions, run CFD/FEA analyses, and lead cross-functional teams across silicon, firmware, manufacturing, and operations to deliver reliable, scalable systems for AWS ML/AI services.