Senior Thermal & Mechanical Packaging Engineer (Data Center)

Amazon Web Services (AWS); Austin (TX); On-site; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs (U.S.) Inc., part of Amazon Web Services, is seeking a Sr. Thermal & Mechanical Packaging Engineer in Austin, TX.

You will design and build packaging systems for the world's largest computing infrastructure, from circuit-level concepts to high-volume manufacturing. You will optimize thermal and mechanical solutions to meet performance, cost, and reliability targets, work with cross-functional teams, and validate designs with CFD/FEA tools and lab experiments.

Qualifications

• Master's degree in mechanical engineering or equivalent.
• 5+ years industry experience in advanced packaging of semiconductors.
• 10+ years industry experience in mechanical design of semiconductor-based systems.
• Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs.
• Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software.

Responsibilities

• Design and build the systems that are the heart of the world's largest computing infrastructure.
• Develop from circuit design to large system design including thermal and mechanical solutions.
• Collaborate with vendors and internal teams to triage, debugging, and resolve issues across organization.

Skills

Mechanical design

Thermal packaging

DOE / Six Sigma

CFD/FEA tools

Cross-functional communication

Education

Master's degree in mechanical engineering or equivalent

Tools

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Job description

Annapurna Labs (U.S.) Inc., part of Amazon Web Services, is seeking a Sr. Thermal & Mechanical Packaging Engineer in Austin, TX.

You will design and build packaging systems for the world's largest computing infrastructure, from circuit-level concepts to high-volume manufacturing. You will optimize thermal and mechanical solutions to meet performance, cost, and reliability targets, work with cross-functional teams, and validate designs with CFD/FEA tools and lab experiments.