Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

Annapurna Labs; Austin (TX); On-site; USD 154,000 - 215,000; Full time

Job summary

Annapurna Labs in USA, Texas, Austin is seeking a Thermal & Mechanical Packaging Engineer to lead design and optimization of packaging for high-performance computing infrastructure. You will drive from circuit-level concepts to high-volume manufacturing, shaping hardware used in our data centers and impacting millions of users.

The role emphasizes collaboration across disciplines, advanced modeling and hands-on testing to validate designs, with a focus on reliability, cost efficiency, and

Qualifications

• Master's degree in mechanical engineering or equivalent.
• 3+ years industry experience in advanced packaging of semiconductors.
• Experience designing and testing test vehicles to assess future packaging architectures.

Responsibilities

• Design and build thermal and mechanical packaging systems for large-scale data center hardware and optimize for quality, performance and cost.

Skills

Customer communication

Mechanical design

Packaging design

Thermal modeling

Cross-functional collaboration

Education

Master's degree in mechanical engineering

Tools

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Job description

Description

As a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you'll work with thought leaders in multiple technology areas. You'll have high standards for yourself and everyone you work with, and you'll be constantly looking for ways to improve your products performance, quality and cost. We're changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities

As a Thermal & Mechanical Packaging Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users.

Basic Qualifications

• Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs
• Master's degree in mechanical engineering or equivalent
• 3+ years industry experience in advanced packaging of semiconductors
• Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials
• Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals
• 5+ years industry experience in mechanical design of semiconductor-based systems - silicon, packaging, and system design
• Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization
• Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software

Preferred Qualifications

• Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
• Strong understanding of product development lifecycles from concept through high volume manufacturing
• Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs.
• Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
• Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies.
• Knowledge of hardware and software based thermal / power management control algorithms
• Validated thermal models through power/thermal measurements on Hardware

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you're applying in isn't listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, TX, Austin - 153,600.00 - 215,000.00 USD annually

Company

Annapurna Labs (U.S.) Inc.

Job ID: A10587153