Senior Thermal & Mechanical Packaging Architect

Annapurna Labs (U.S.) Inc.; Austin (TX); Presencial; USD 130.000 - 170.000; Jornada completa

Descripción de la vacante

Annapurna Labs (U.S.) Inc. in Austin seeks a Thermal & Mechanical Packaging Engineer to design and optimize hardware for AWS data centers.

You will develop from circuit level to system level, including thermal solutions, and push designs toward high volume manufacturing. You’ll lead DOE studies, perform CFD/FEA with tools like ANSYS/ABAQUS/COMSOL, and collaborate across vendors, ODMs, and internal teams to meet performance, cost, and reliability targets.

Formación

• Master's degree in mechanical engineering or equivalent required.
• 3+ years in advanced packaging of semiconductors.
• 5+ years mechanical design of semiconductor-based systems.
• Experience with packaging vendors, ODMs, and cross-functional teams.
• Proficiency with ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent CFD/FEA tools.
• Ability to design and test vehicles to assess future packaging architectures.

Responsabilidades

• Design and build systems for high-performance data center hardware.
• Develop from circuit to system level including thermal/mechanical solutions.
• Collaborate with vendors and internal teams to meet quality, performance, and cost goals.

Conocimientos

Effective communication

Thermal design

Mechanical design

DOE / Six Sigma

Lab/test setup

CFD/FEA software

Educación

Master's degree in mechanical engineering or equivalent

5+ years mechanical packaging experience

Herramientas

ANSYS

ABAQUS

COMSOL

FLOTHERM

ICEPACK

Descripción del empleo

Annapurna Labs (U.S.) Inc. in Austin seeks a Thermal & Mechanical Packaging Engineer to design and optimize hardware for AWS data centers.

You will develop from circuit level to system level, including thermal solutions, and push designs toward high volume manufacturing. You’ll lead DOE studies, perform CFD/FEA with tools like ANSYS/ABAQUS/COMSOL, and collaborate across vendors, ODMs, and internal teams to meet performance, cost, and reliability targets.