Senior Design Automation Engineer - Packaging & PCB

Amazon Inc.; Austin (TX); On-site; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen machine learning and data center ASICs. You will develop automation to enable physical design teams from floor planning to tape‑out and manufacturing release.

Collaborate with SI/PI, thermal and manufacturing teams; apply Python, TCL and Skill to deliver production‑ready designs meeting performance, density and reliability targets.

Qualifications

• 7+ years of experience with physical design tools in Package/PCB domains.
• 10+ years of automation experience for physical designs.

Responsibilities

• Develop and deploy design methodologies for Package and PCB layout across the design cycle.
• Evaluate industry EDA offerings for advanced packaging technologies (2.5D, 3D-IC).
• Deliver custom design automation to improve RDL and substrate routing for high-density interconnects.
• Collaborate across die RDL, interposer/substrate, and PCB levels with senior engineers.
• Develop data integration flows across Package, PCB and SI/PI.
• Develop software in Python, Skill, TCL; use AI coding agents to speed development.
• Integrate physical verification checks (DRC, connectivity, shorts/opens) into design cycles.
• Work with OSAT partners and foundries to ensure DFM compliance.
• Collaborate with SI/PI engineers for impedance-controlled routing and power plane optimization.

Skills

7+ years experience in physical design

Automation for physical designs

Python/Scripting

Education

Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering

Tools

Allegro

APD

3DICC

Expedition

Job description

Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen machine learning and data center ASICs. You will develop automation to enable physical design teams from floor planning to tape‑out and manufacturing release.

Collaborate with SI/PI, thermal and manufacturing teams; apply Python, TCL and Skill to deliver production‑ready designs meeting performance, density and reliability targets.