Senior Thermal-Mechanical Engineer, Semiconductor Packaging

ChipAdd Corp.; City of Binghamton (NY); Sur place; USD 120 000 - 155 000; Plein temps

Avantages offerts par ce poste

Equity

Medical, dental and vision coverage

Paid time off

Competitive base salary

Résumé du poste

CHIPADD is based in Binghamton, NY, near the birthplace of IBM, with leadership in Silicon Valley. Our culture runs on curiosity, execution and a deep commitment to the mission.

Senior Package Thermal-Mechanical Engineer role shapes designs and materials choices, runs FEA models for chip/package/board assemblies, and leads qualification to JEDEC and IPC standards while translating customer reliability needs into test plans.

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science or a related field.
• 5-7 years of experience in thermomechanical modeling and design of semiconductor packages or device-level electronics.
• Experience with nonlinear material models and solder fatigue modeling.

Responsabilités

• Build and run finite element models of chip, package and board assemblies for thermal and thermomechanical behavior.
• Model solder joint fatigue under thermal cycling and mechanical loading, predicting lifetime.
• Guide cooling design and characterize material properties for models.

Connaissances

Thermal-Mechanical modeling

FEA expertise

Problem solving

Cross-functional collaboration

Technical presentation

Formation

MS or PhD in Mechanical Engineering or Materials Science

Outils

Ansys Mechanical

Abaqus

CSAM

X-ray

CT

SEM/EDS

Dye-and-pry

Description du poste

CHIPADD is based in Binghamton, NY, near the birthplace of IBM, with leadership in Silicon Valley. Our culture runs on curiosity, execution and a deep commitment to the mission.

Senior Package Thermal-Mechanical Engineer role shapes designs and materials choices, runs FEA models for chip/package/board assemblies, and leads qualification to JEDEC and IPC standards while translating customer reliability needs into test plans.