Chief Product & Engineering – Breakthrough Thermal Tech

ChipAdd Corp.; City of Binghamton (NY); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Equity

Health insurance

Paid time off

Job summary

CHIPADD, based in Binghamton, NY, seeks a senior engineering leader to own the product roadmap for advanced chip cooling and lead a growing team through qualification and production.

You will work directly with customers, define priorities, and implement SOPs and development gates. A strong background in semiconductor packaging, thermal management, and program management is essential for success.

Qualifications

• Advanced engineering degree plus hands-on semiconductor experience.
• 10+ years in product/process engineering with 5+ years leading teams.
• Experience in semiconductor packaging, thermal management or related electronics.
• Proven track record taking hardware from development through production.
• Strong program management and cross-functional leadership.

Responsibilities

• Own the product roadmap for advanced chip cooling from samples to volume launch.
• Collaborate with customers and partners to define requirements and priorities.
• Translate needs into specs, gates and development plans.
• Lead and grow the engineering team and coaches.
• Develop scalable SOPs and engineering processes.
• Promote data-driven analytics and decision making.
• Manage schedules, budgets, risks, and dependencies with leadership."
• Coordinate with manufacturing and reliability to balance performance, cost, and manufacturability.
• Represent CHIPADD in customer reviews and industry forums.

Skills

Product engineering leadership

Program management

Data-driven analytics

People leadership & hiring

Customer-facing communication

Education

MS or PhD in Mechanical/Materials/Semiconductor or related engineering field

Tools

JMP

DOE

SPC

Job description

CHIPADD, based in Binghamton, NY, seeks a senior engineering leader to own the product roadmap for advanced chip cooling and lead a growing team through qualification and production.

You will work directly with customers, define priorities, and implement SOPs and development gates. A strong background in semiconductor packaging, thermal management, and program management is essential for success.