Thermal & Thermo-Mechanical Engineer, Semiconductor Packaging

Acceler8 Talent; Massachusetts; Presencial; USD 132.000 - 220.000; Jornada completa

Descripción de la vacante

Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer in a hands-on, fast-paced environment. The role focuses on modeling dense, multi-material semiconductor packages and 3D systems, translating simulations into practical design choices for architecture, materials, interfaces and cooling.

Ideal candidates will own thermal analysis from simulation through hardware validation, collaborating with electrical, packaging and reliability teams to resolve trade-offs.

Formación

• Deep ownership of thermal or thermo-mechanical engineering in semiconductor packaging.
• Hands-on FEA or multiphysics experience with real hardware impact.
• Experience translating simulations to hardware implementation and testing.
• Ability to explain modeling assumptions and boundary conditions.
• Understanding of how materials, interfaces and package construction affect thermal/mechanical behavior.
• Comfort working across mechanical, packaging and electrical disciplines in a small team.

Responsabilidades

• Model thermal and thermo-mechanical behaviour in high-density semiconductor packages and 3D systems.
• Translate simulation results into decisions about package architecture, materials, interfaces and cooling.
• Work with electrical, packaging and reliability engineers to resolve coupled system trade-offs.
• Carry analysis through implementation, testing and design iteration.
• Validate predictions against measured hardware and feed findings into the next design.
• Help establish thermal-design and validation practices within a founding-stage semiconductor team.

Conocimientos

Thermal modelling

FEA / multiphysics

Semiconductor packaging

Hardware validation

Cross-functional collaboration

Explain modelling assumptions

Descripción del empleo

Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer in a hands-on, fast-paced environment. The role focuses on modeling dense, multi-material semiconductor packages and 3D systems, translating simulations into practical design choices for architecture, materials, interfaces and cooling.

Ideal candidates will own thermal analysis from simulation through hardware validation, collaborating with electrical, packaging and reliability teams to resolve trade-offs.