Thermal Engineer

Acceler8 Talent; Boston (MA); Vor Ort; USD 100.000 - 160.000; Vollzeit

Zusammenfassung

Acceler8 Talent partners with an MIT-founded semiconductor startup in Boston developing a novel chip packaging approach using GaN, silicon and diamond with 3D integration for radar and satellite communications.

The role seeks a thermo-mechanical engineer who can model problems, make design decisions and validate them on hardware, collaborating directly with the founders.

Qualifikationen

• Strong academic background in mechanical engineering, materials science or applied physics.
• Experience with chips and semiconductor packaging, ideally including 2D/3D integration and multi-material structures.
• Thermal and thermo-mechanical modelling skills in ANSYS, Abaqus or COMSOL, backed by physical testing and understanding of stress, warpage and reliability.
• Examples of work you’ve personally owned—from material choices and design changes to building and validating hardware.

Aufgaben

• Develop thermal and thermo-mechanical models for chip and package architectures, including 2D/3D integration.
• Guide decisions on materials, thermal interfaces, heat spreaders and cooling.
• Assess thermal expansion, stress, warpage and delamination.
• Design experiments, test hardware and correlate measured performance with model predictions.
• Own engineering problems from initial analysis through implementation and validation.

Kenntnisse

Thermal modelling

Thermo-mechanical modelling

2D/3D integration

Packaging experience

Materials science background

Ausbildung

Mechanical engineering or materials science or applied physics

Tools

ANSYS

Abaqus

COMSOL

Jobbeschreibung

Thermo-Mechanical Engineer | Boston | Onsite

We’re working with an MIT-founded semiconductor startup that has raised over $22M to develop a new approach to building chips. They’re combining materials including GaN, silicon and diamond through 3D integration, initially for radar and satellite communications.

They’re looking for a thermo-mechanical engineer who can model a problem, make the design decisions and test whether they work. You’ll work directly with the founders on chip packaging, materials, thermal interfaces and heat spreading, with real responsibility for the hardware being built.

What you’ll do

• Develop thermal and thermo-mechanical models for chip and package architectures, including 2D/3D integration.
• Guide decisions on materials, thermal interfaces, heat spreaders and cooling.
• Assess coupled challenges such as thermal expansion, stress, warpage and delamination.
• Design experiments, test hardware and correlate measured performance with model predictions.
• Own engineering problems from initial analysis through implementation and validation.

What they’re looking for:

• A strong academic background in mechanical engineering, materials science or applied physics. Relevant university research in packaging or thermal management is valued.
• Experience working with chips and semiconductor packaging, ideally including 2D/3D integration and multi-material structures.
• Thermal and thermo-mechanical modelling skills in ANSYS, Abaqus or COMSOL, backed by physical testing and an understanding of stress, warpage and reliability.
• Examples of work you’ve personally owned - from choosing materials and making design changes through to building and validating hardware.

The team is small, so you’ll have a direct say in how the technology develops and plenty of scope beyond a narrowly defined role.