Senior Reflow and Attach Process Engineer

ChipAdd Corp.; City of Binghamton (NY); On-site; USD 125,000 - 155,000; Full time

Job summary

ChipAdd Corp., based in Binghamton, NY, is seeking a Senior Reflow and Attach Process Engineer to design and implement the attach process for bonding cooling technology to silicon die, packages, and boards. This full-time role emphasizes production-scale reliability and precision in reflow and attachment processes.

As a senior member of the team, you will own end-to-end process development, drive scale-up, and collaborate with cross-functional groups to ensure robust manufacturing.

Responsibilities

• Develop the attach process for bonding CHIPADD’s cooling technology to silicon die, packages and boards

Job description

Senior Reflow and Attach Process Engineer

• Employment type: Full-time
• Seniority: Senior
• Salary range: $125,000 – $155,000 per year + equity

Attaching copper cooling to a $40,000 chip leaves no room for "pretty good." You'll build the reflow process that gets it right every time, at production scale.

About CHIPADD

CHIPADD is based in Binghamton, NY, close to the original birthplace of IBM, and we have leadership based in Silicon Valley as well. Our culture runs on curiosity, execution and a deep commitment to the mission.

What You’ll Do

• Develop the attach process for bonding CHIPADD’s cooling technology to silicon die, packages and boards