Staff Engineer, Advanced IC Packaging & Thermal Analysis

Analog Devices, Inc.; Wilmington (MA); On-site; USD 113,000 - 164,000; Full time

Benefits offered by this job

Medical, vision and dental coverage

401k

Paid vacation

Holidays

Sick time

Job summary

Analog Devices, Inc. is seeking a Staff Engineer in Semi Packaging Engineering in Wilmington, MA.

You will lead the development of advanced packaging solutions, including wire-bond, flip-chip, SIP, and module-based products, balancing reliability, manufacturability and cost. You will perform mechanical and thermal analyses, conduct FEM simulations, and work with cross-functional teams and OSAT partners to optimize packaging architectures and improve yield.

Qualifications

• PhD or MS in Mechanical or Electrical Engineering.
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Responsibilities

• Lead the design, development and qualification of semiconductor packaging solutions (wire-bond, flip-chip, SIP, module-based).
• Provide mechanical and thermal analysis to support architecture selection, design optimization and reliability risk assessment.
• Perform FEM simulations to evaluate chip-package and package-board interactions, warpage, stress and reliability.
• Collaborate with cross-functional teams, OSAT partners, suppliers to drive process development and improve yield.
• Develop and maintain package design guidelines, specs, and documentation.

Skills

Packaging engineering

Cross-functional collaboration

Analytical skills

Mechanical reasoning

Education

PhD or MS in Mechanical or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

Analog Devices, Inc. is seeking a Staff Engineer in Semi Packaging Engineering in Wilmington, MA.

You will lead the development of advanced packaging solutions, including wire-bond, flip-chip, SIP, and module-based products, balancing reliability, manufacturability and cost. You will perform mechanical and thermal analyses, conduct FEM simulations, and work with cross-functional teams and OSAT partners to optimize packaging architectures and improve yield.