Mechanical Design Engineer, Thermal Packaging for AI Chips

Boston Materials; Billerica (MA); Vor Ort; USD 80.000 - 120.000; Vollzeit

Benefits dieser Stelle

Health, Vision & Dental coverage (75%"

4 weeks supplemental Paid Parental and

Unlimited Paid Time Off

Holidays 14 days/year

Zusammenfassung

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints facing AI and HPC silicon.

This early-career Mechanical Design Engineer role focuses on design, prototyping, and testing in semiconductor packaging and thermal management.

Qualifikationen

• Bachelor's or Master's degree in Mechanical Engineering.
• 0–3 years of professional experience; early-career role.
• Proficiency with CAD and GD&T.

Aufgaben

• Create CAD models and drawings for TIM products.
• Build and test assembly mockups and fixtures.
• Run thermal and mechanical tests and analyze data.
• Coordinate part fabrication with internal and external resources.
• Support senior engineers in customer engagements and design guides.
• Maintain design files and documentation for qualification processes.

Kenntnisse

CAD modeling

GD&T

Prototyping

Data analysis

Technical writing

Communication

Electronics packaging

Ausbildung

Bachelor's or Master's in Mechanical Engineering

Tools

SolidWorks

Creo

Python

MATLAB

Jobbeschreibung

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints facing AI and HPC silicon.

This early-career Mechanical Design Engineer role focuses on design, prototyping, and testing in semiconductor packaging and thermal management.