Senior Substrate Supplier Enablement Engineer

Intel; Phoenix (AZ); On-site; USD 141,000 - 199,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly group seeks an experienced engineer to lead supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates. You will drive readiness milestones and collaborate with cross-functional teams and suppliers, with occasional travel to sites.

Minimum qualifications include advanced engineering degree with several years of experience in packaging or semiconductor manufacturing, plus

Qualifications

• Experience with SPC and yield improvement.
• Experience managing complex projects in high-volume manufacturing.
• Experience with packaging, substrates, or semiconductor manufacturing.
• Experience with process flow development, FMEA, DOE design, and/or problem-solving tools.

Responsibilities

• Collaborate with suppliers and engineering teams to develop building block processes across embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection, testing.
• Partner with onsite supplier engineering teams to advance substrate building block technologies and manage cross-functional interactions.
• Ensure suppliers meet PCS commitments with rigor and consistency.
• Design and implement factory technology validation and product certification plans focused on yield improvement.
• Develop micro-schedules for new factory startup activities and key milestones.
• Lead qualification activities and monitor ramp indicators for smooth production ramp.

Skills

Statistical methods

Project management

Semiconductor packaging

DOE / FMEA tools

Education

Bachelor's degree with 6+ years experience

Master's degree with 4+ years experience

PhD with 2+ years experience

Job description

Intel's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly group seeks an experienced engineer to lead supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates. You will drive readiness milestones and collaborate with cross-functional teams and suppliers, with occasional travel to sites.

Minimum qualifications include advanced engineering degree with several years of experience in packaging or semiconductor manufacturing, plus