Senior Substrate Supplier Enablement Engineer

Intel

Phoenix (AZ)

On-site

USD 141,000 - 199,000

Full time

2 days ago

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Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly group seeks an experienced engineer to lead supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates. You will drive readiness milestones and collaborate with cross-functional teams and suppliers, with occasional travel to sites.

Minimum qualifications include advanced engineering degree with several years of experience in packaging or semiconductor manufacturing, plus

Qualifications

Experience with SPC and yield improvement.
Experience managing complex projects in high-volume manufacturing.
Experience with packaging, substrates, or semiconductor manufacturing.
Experience with process flow development, FMEA, DOE design, and/or problem-solving tools.

Responsibilities

Collaborate with suppliers and engineering teams to develop building block processes across embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection, testing.
Partner with onsite supplier engineering teams to advance substrate building block technologies and manage cross-functional interactions.
Ensure suppliers meet PCS commitments with rigor and consistency.
Design and implement factory technology validation and product certification plans focused on yield improvement.
Develop micro-schedules for new factory startup activities and key milestones.
Lead qualification activities and monitor ramp indicators for smooth production ramp.