Substrate Supplier Enablement Engineer

Intel; Phoenix (AZ); On-site; USD 141,000 - 199,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel's Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly group seeks an experienced engineer to lead supplier development and qualification for high-density FCBGA, EMIB-T, and glass core substrates. You will drive readiness milestones and collaborate with cross-functional teams and suppliers, with occasional travel to sites.

Minimum qualifications include advanced engineering degree with several years of experience in packaging or semiconductor manufacturing, plus

Qualifications

• Experience with SPC and yield improvement.
• Experience managing complex projects in high-volume manufacturing.
• Experience with packaging, substrates, or semiconductor manufacturing.
• Experience with process flow development, FMEA, DOE design, and/or problem-solving tools.

Responsibilities

• Collaborate with suppliers and engineering teams to develop building block processes across embedding, core fabrication, laser drilling, lamination, lithography, plating, inspection, testing.
• Partner with onsite supplier engineering teams to advance substrate building block technologies and manage cross-functional interactions.
• Ensure suppliers meet PCS commitments with rigor and consistency.
• Design and implement factory technology validation and product certification plans focused on yield improvement.
• Develop micro-schedules for new factory startup activities and key milestones.
• Lead qualification activities and monitor ramp indicators for smooth production ramp.

Skills

Statistical methods

Project management

Semiconductor packaging

DOE / FMEA tools

Education

Bachelor's degree with 6+ years experience

Master's degree with 4+ years experience

PhD with 2+ years experience

Job description

Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. Please note: This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as occasional trip to supplier sites to support essential program objectives.

Responsibilities

• Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies.
• Partner closely with onsite supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
• Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
• Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement.
• Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines.
• Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.

Experience listed above should be a combination of the following:

• Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement.
• Experience managing complex projects and deliver results in high-volume manufacturing environments.
• Experience with packaging, substrates, or semiconductor manufacturing.
• Experience with process flow development, FMEA, DOE design, and/or problem-solving tools.

Preferred Qualifications

• Proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams
• Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location: US, Arizona, Phoenix

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $140,830.00 - 198,820.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.