Packaging Process Engineer – Advanced Semiconductors

Intel Corporation

Phoenix, Northern (AZ, KY)

Hybrid

USD 115,000 - 220,000

Full time

3 days ago

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Benefits offered by this job

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Job summary

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, AZ seeks a Packaging Module Development Engineer to develop, optimize, and qualify advanced semiconductor packaging processes for high-volume production.

You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.

Qualifications

Master's degree with 3+ years of relevant experience or PhD with 1+ year in STEM fields.
Experience in process development and equipment qualification in manufacturing.

Responsibilities

Develop and optimize packaging assembly processes and equipment for high-volume manufacturing.
Design and execute SPC/DOE experiments to characterize processes and drive improvements.
Collaborate with cross-functional teams to ensure successful product launches.
Document findings and lead standardization across Intel sites.

Skills

Data analysis

SPC & DOE

Process characterization

Packaging flows knowledge

Quality systems

Education

Master's + 3+ years OR PhD in Mechanical Engineering, Physics, Chemistry or related STEM with 1+ years experience

Tools

Python

MATLAB

SQL

Job description

You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.

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