Substrate Supplier Enablement Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 141,000 - 199,000; Full time

Job summary

Intel Corporation in Phoenix is seeking a Substrate Supplier Enablement Engineer to drive supplier development and qualification for advanced packaging technologies such as high density FCBGA, EMIB-T, and glass core substrates.

You will lead collaborations with suppliers and internal teams, manage readiness milestones, and contribute to achieving supply ramp goals while visiting supplier sites as needed.

Qualifications

• Bachelor's degree with 6+ years experience in Mechanical, Materials, or related field.
• Master's degree with 4+ years, or PhD with 2+ years of experience in a technical domain.
• Experience with packaging, substrates or semiconductor manufacturing.
• Experience with SPC and yield improvement; familiarity with DOE/ design of experiments.

Responsibilities

• Collaborate with suppliers and internal teams to develop substrate processes.
• Partner with supplier engineering teams to advance substrate technologies and manage interactions.
• Ensure PCS commitments are met with rigor and consistency.
• Design and implement factory technology validation and product certification plans.
• Develop micro schedules for new factory startup activities and milestones.
• Lead qualification activities and monitor ramp indicators for smooth production.

Skills

SPC

Yield improvement

Packaging substrates

Process flow

FMEA/DOE

Problem solving

Supplier management

Education

Bachelor's degree

Master's degree

PhD

Job description

## Substrate Supplier Enablement EngineerApplylocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0285899# **Job Details:**## Job Description:The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. Please note: This role requires periodic meetings with suppliers in East Asia and stakeholder in US, as well as occasional trip to supplier sites to support essential program objectives. **Responsibilities**• Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies. • Partner closely with onsite supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions. • Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency. • Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement. • Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines. • Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity. ## **Qualifications:**Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.**Minimum Qualifications**- Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field. Experience listed above should be a combination of the following:- Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement. - Experience managing complex projects and deliver results in high-volume manufacturing environments.- Experience with packaging, substrates, or semiconductor manufacturing.- Experience with process flow development, FMEA, DOE design, and/or problem-solving tools. **Preferred Qualifications**- Proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams - Proven ability to thrive in high-ambiguity environments and deliver results under pressure. Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $140,830.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \* Job posting details (such as work model, location or time type) are subject to change.