Lead Packaging Substrate Engineer — Roadmap & Innovation

Apple Inc.; San Francisco (CA); On-site; USD 181,100 - 318,400; Full time

Benefits offered by this job

Comprehensive medical and dental coverage

Retirement benefits

Employee stock programs

Discounted products and services

Educational expense reimbursement

Job summary

A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits.

Qualifications

• 10+ years of relevant industry experience.
• In-depth knowledge of substrate technology and manufacturing processes.
• Hands-on experience in substrate manufacturing and technology development.

Responsibilities

• Lead SoC package substrate technology development.
• Work with industry partners to develop new substrate technologies.
• Problem solving of technical issues during the full product development cycle.

Skills

Substrate technology

Project management

Material engineering

Problem solving

Cadence Allegro tools

Education

BS in relevant field

MS or Ph.D. in material/chemistry/mechanical engineering

Job description

A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits.