SIPI Engineer, Sr.

QUALCOMM, Inc.; San Diego (CA); On-site; USD 134,000 - 201,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking engineers for the CHS area to advance signal integrity and power integrity in next-generation server projects.

You will collaborate with IC, Package and PCB designers to optimize system performance and ensure all constraints are met before the package tape-out. The role includes package extraction for time and frequency domain analysis, system-level DDR/SerDes/PDN analysis, and developing design guidelines.

Qualifications

• Bachelor's degree in relevant engineering with 2+ years in system/package design.
• Master's degree with 1+ year in system/package engineering.
• PhD with related field; considered with minimal experience.

Responsibilities

• Perform package extraction for the time domain and frequency domain analysis
• Perform system-level analysis for DDR, SerDes & PDN analysis
• Develop design guidelines for Package and PCB design
• Create technical documentation and presentations

Skills

DDR/SerDes

Electromagnetics

HFSS

Clarity

Matlab

Education

Bachelor's degree

Master's degree

PhD

Tools

Q3D

Sentinel-PSI

Cadence Allegro

Mentor Xpedition

ADS

Hspice

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Packaging Engineering

Summary

The Qualcomm CHS (Central Hardware System) has exciting opportunities in the areas of signal integrity and power integrity in next generation server project. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate's first responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LP6, PCIe, 224G, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as IP, PKG & PCB design and simulation teams.

Responsibilities

• Perform package extraction for the time domain and frequency domain analysis
• Perform system-level analysis for DDR, SerDes & PDN analysis
• Develop design guidelines for Package and PCB design
• Create technical documentation and presentations

Preferred Qualifications

• 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to compute, Auto and/or Server projects
• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
• Experience in simulation tools such as ADS and Hspice
• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
• Experience in utilizing AI to gain efficiency is a strong plus.
• Experience in Matlab
• Experience in design specifications such as LPDDRx, PCIe, Xlink
• Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well

Minimum Qualifications

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Equal Opportunity & Disability Accommodations

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

EEO Statement

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Employee Policies

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay Range and Other Compensation & Benefits

• $133,900.00 - $200,900.00
• The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.