Senior Packaging SI/PI Engineer for High-Speed SerDes

QUALCOMM, Inc.; San Diego (CA); On-site; USD 210,000 - 315,000; Full time

Job summary

Qualcomm Technologies, Inc. in San Diego invites an experienced engineer to drive signal and power integrity tasks across packaging, platform, and IC design. You will perform electrical model extraction, run high-speed simulations, and report results clearly.

This role requires collaboration with board, package, and IC teams to optimize designs for high-speed SerDes applications in computing and server projects. A strong background in electromagnetics and experience with HFSS/Q3D is preferred.

Qualifications

• Experience with high-speed SerDes package and system design.
• Strong background in electromagnetics and transmission line theory.
• Proficiency with field solvers and SPICE tools; familiarity with IBIS/AMI is a plus.

Responsibilities

• Perform IO analysis using established methodologies including model extraction, simulation, and reporting.
• Analyze IO power distribution for product development and reference systems.
• Perform package extraction for time- and frequency-domain analysis and provide guidelines.
• Document results clearly and thoroughly and collaborate with board, package, and IC teams.

Skills

Electromagnetics

High-speed SerDes

IO model extraction

Cross-disciplinary collaboration

Programming/scripting

Education

Bachelor's degree

Master's degree

PhD

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

HSPICE

Job description

Qualcomm Technologies, Inc. in San Diego invites an experienced engineer to drive signal and power integrity tasks across packaging, platform, and IC design. You will perform electrical model extraction, run high-speed simulations, and report results clearly.

This role requires collaboration with board, package, and IC teams to optimize designs for high-speed SerDes applications in computing and server projects. A strong background in electromagnetics and experience with HFSS/Q3D is preferred.