Senior SiPh Packaging & Assembly Lead (2.5D/3D Photonics)

Global Foundries; Essex Junction (VT); On-site; USD 166,000 - 291,000; Full time

Job summary

GlobalFoundries is seeking a DMTS-grade leader to drive the Photonix platform growth, focusing on fully packaged electro-optical transceivers and 2.5D/3D co-packaged optics. You will define reliability plans, packaging design rules, and materials selection criteria for chiplet modules with OSAT ecosystem collaboration.

The role requires leadership in product definition, test methodology, and collaboration across electrical/photonic interconnects, optical fiber attach options, and advanced

Qualifications

• MS or PhD with 20+ years of experience in photonic/electronic packaging.
• Expertise in photonic/electronic package architectures and testing.
• Experience taking packaged products from development to production for data centers, automotive, and communications.

Responsibilities

• Serve as GF technical expert for SiPh packaging and provide leadership in design reviews.
• Define test, reliability, and qualification plans for chiplet/product modules.
• Collaborate with OSAT partners to enable manufacturing and packaging maturity.
• Ensure standardization of quality processes and robust qualification.
• Support safe, environmentally responsible operations.

Skills

Photonic packaging

Electronic packaging

2.5D/3D packaging

Test & measurement methodology

Product release in OSAT ecosystem

Reliability qualification

Chip-package interaction

Thermal/Mechanical simulation

Education

MS or PhD in a relevant field

Job description

GlobalFoundries is seeking a DMTS-grade leader to drive the Photonix platform growth, focusing on fully packaged electro-optical transceivers and 2.5D/3D co-packaged optics. You will define reliability plans, packaging design rules, and materials selection criteria for chiplet modules with OSAT ecosystem collaboration.

The role requires leadership in product definition, test methodology, and collaboration across electrical/photonic interconnects, optical fiber attach options, and advanced