Senior Optical Packaging Engineer – Silicon Photonics

Global Foundries; Essex Junction (VT); On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries seeks a Packaging Engineer to lead development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss packaging architectures that meet performance and reliability targets.

Responsibilities include defining packaging architectures, fiber-to-chip coupling strategies, 2.5D/3D/3.5D HI packaging, multiphysics simulations, and

Qualifications

• Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
• 8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands‑on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip‑chip, underfill, molding, and micro‑optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem‑solving, and communication skills.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules.
• Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Drive HI of photonic and electronic components using 2.5D/3D/3.5D packaging technologies.
• Perform multiphysics simulations to optimize package performance.
• Lead root cause analysis for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal teams for mass production readiness and transfer.
• Support cost modeling and drive package cost reductions.
• Present updates and roadmaps to stakeholders and partners.

Skills

Semiconductor packaging experience

Fiber attach & photonic alignment

Cross-functional collaboration

English communication

Education

Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field

Tools

Lumerical

COMSOL

Python-based test setups

Job description

GlobalFoundries seeks a Packaging Engineer to lead development and sustainment of advanced optical packaging for silicon photonics and co-packaged optics. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss packaging architectures that meet performance and reliability targets.

Responsibilities include defining packaging architectures, fiber-to-chip coupling strategies, 2.5D/3D/3.5D HI packaging, multiphysics simulations, and