Senior Packaging Architect, Photonics & HPC Systems

Lightmatter, Inc.; Mountain View, Northern (CA, KY); Hybrid; USD 218,000 - 317,000; Full time

Benefits offered by this job

Retirement Matching

Life Insurance

Paid Time Off

Paid Family Leave

Disability Insurance

Training & Development

Hybrid Work Model

Equity Grants

Job summary

Lightmatter is seeking a Packaging Architect to lead the development of advanced packaging solutions from concept to product release. You will partner with substrate design, signal integrity, and power integrity teams to translate requirements into precise packaging specifications that balance performance, cost, and manufacturability.

You will drive architecture trade-offs, align stakeholders, and ensure packaging meets engineering and business goals across the full product lifecycle.

Qualifications

• Advanced packaging experience required, including 2D/3D packaging.
• Expertise in power and signal integrity, thermal-mechanical analysis, or optical packaging.
• Ability to evaluate silicon–package–board trade-offs for complex products.

Responsibilities

• Evaluate trade-offs across layouts and attachment methods affecting performance and cost.
• Define packaging specifications for electrical, thermal, and mechanical performance.
• Determine optimal package architecture across silicon, package, and system levels.
• Collaborate with supply chain to define material requirements for fabrication and assembly.
• Work with Q&R to set qualification criteria and resolve issues.
• Engage with product teams and customers to guide roadmap direction.
• Monitor competitive packaging technologies to inform decisions.

Skills

Power/Signal integrity

Thermal-mechanical analysis

Optical packaging

System-level trade-offs

High-speed interfaces

SERDES PCIe D2D knowledge

Packaging architecture decisions

Cross-functional leadership

Industry CAD/EDA tools

Education

Ph.D. or Master's in Electrical/Mechanical Engineering or Materials Science

Tools

EDA tools

CAD tools

Job description

Lightmatter is seeking a Packaging Architect to lead the development of advanced packaging solutions from concept to product release. You will partner with substrate design, signal integrity, and power integrity teams to translate requirements into precise packaging specifications that balance performance, cost, and manufacturability.

You will drive architecture trade-offs, align stakeholders, and ensure packaging meets engineering and business goals across the full product lifecycle.