Senior Silicon Packaging Engineer for AI/ML HPC

Meta; Sunnyvale (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Meta is seeking an experienced Silicon Packaging Engineer to join the Ecosystem and Technical Operation team. The role requires prioritizing competing workstreams across a cross-functional environment and driving hardware development for AI/HPC systems from concept to production.

Key expertise includes flip chip, 2.5D/3D packaging, interposer and fanout designs, and the ability to develop manufacturing specifications, qualify vendors, and improve costs and efficiencies while collaborating with

Qualifications

• Bachelor's degree in CS/CE or related field or equivalent experience.
• 8+ years of experience in semiconductor packaging and manufacturing.
• Deep knowledge of flip chip, 2.5D and 3D packaging.
• Experience drafting manufacturing specs and vendor qualifications.

Responsibilities

• Design and bring-up hardware systems for AI/HPC platforms.
• Test and integrate hardware with ML clusters from silicon to system level.
• Develop manufacturing specifications and qualify vendors.
• Collaborate with ODM/OSAT and foundry partners across teams.

Skills

Semiconductor packaging

Flip chip

2.5D packaging

3D packaging

Interposer design

Vendor qualification

Cross-functional teamwork

Cost optimization in manufacturing

Education

Bachelor's degree in CS/CE or related

Master's degree in Materials Science / Mechanical / Electrical

PhD in related field

Tools

PCB design tools

SMT processes

Layout tools

Job description

Meta is seeking an experienced Silicon Packaging Engineer to join the Ecosystem and Technical Operation team. The role requires prioritizing competing workstreams across a cross-functional environment and driving hardware development for AI/HPC systems from concept to production.

Key expertise includes flip chip, 2.5D/3D packaging, interposer and fanout designs, and the ability to develop manufacturing specifications, qualify vendors, and improve costs and efficiencies while collaborating with