Senior Signal Integrity Architect, High-Speed Interfaces

Micron Technology; Boise (ID); On-site; USD 190,000 - 240,000; Full time

Job summary

Micron Technology in the United States is seeking a Principal Signal Integrity Engineer to spearhead high-speed interconnect modeling and SI/PI analysis across memory interfaces. You will own modeling from field extraction to circuit simulation, collaborate across design, packaging, and R&D teams, and drive decisions that shape product readiness.

This senior role demands deep EM knowledge, hands-on measurement, and clear technical communication across disciplines.

Qualifications

• MS or PhD in Electrical Engineering (MS with strong EM/SI accepted).
• 10+ years of industry experience in SI/PI for high-speed interfaces.
• Deep expertise in electromagnetic and transmission line theory for SI/PI.

Responsibilities

• Lead modeling and simulation of interconnects from field solver extractions.
• Evaluate forward-looking substrates and packaging for SI impact.
• Drive feasibility analysis with IO and channel co-optimization.
• Define design rules grounded in EM analysis.
• Define link budgets and sim-to-silicon correlations.

Skills

Electromagnetic fundamentals

SI/PI experience

Time/frequency domain

Hardware measurement tools

Cross-disciplinary collaboration

Communication skills

Education

MS or PhD in Electrical Engineering

Tools

ADS

HSPICE

SPECTRE

Q3D

SIWAVE

HFSS

Oscilloscopes

TDR

VNA

Job description

Micron Technology in the United States is seeking a Principal Signal Integrity Engineer to spearhead high-speed interconnect modeling and SI/PI analysis across memory interfaces. You will own modeling from field extraction to circuit simulation, collaborate across design, packaging, and R&D teams, and drive decisions that shape product readiness.

This senior role demands deep EM knowledge, hands-on measurement, and clear technical communication across disciplines.