Senior Signal Integrity Architect — High-Speed Interfaces

Micron Technology, Inc.

Folsom (CA)

On-site

USD 119,000 - 320,000

Full time

14 days+

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Job summary

Micron Technology is seeking a Principal Signal Integrity Engineer to lead high‑speed interface SI efforts. You will own modeling from extraction to simulation, evaluate substrate/packaging options, and drive pathfinding analyses with cross‑functional partners.

You will work with senior engineers across SI, circuit design, packaging R&D, and system integration to shape design rules and predictive methodologies for pre‑silicon performance. Excellent EM/SI expertise is essential.

Qualifications

MS or PhD in Electrical Engineering or related field; strong EM/SI fundamentals accepted.
10+ years of industry experience in signal or power integrity for high-speed interfaces.
Extensive EM and transmission-line theory applied to SI/PI analyses.
Experience with time- and frequency-domain simulation tools (ADS, HSPICE, SPECTRE).
Experience with electromagnetic field solvers and hardware test‑equipment usage.

Responsibilities

Own generation and validation of interconnect models from extraction to circuit simulation.
Lead SI assessment of forward-looking substrate and packaging technologies.
Drive SI analysis during pathfinding studies and provide direction to teams.
Develop progressive design rules grounded in EM analysis and data.
Define link budgets and sim-to-silicon correlation methodologies.
Collaborate across SI, circuit/ chip design, packaging R&D, and system integration.
Author analysis reports, modeling methodology documents, and design-rule specs.