Senior SI/PI Project Manager — High‑Speed PCB & Packaging

Broadcom; San Jose (CA); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

Employee Stock Purchase Program (ESPP)

Comprehensive benefits package

Job summary

Broadcom is seeking an experienced SI/PI technical project manager to lead and coordinate high-speed SerDes and high-power delivery package designs for ASICs. You will manage cross‑functional teams across global sites, drive technical methodologies, and collaborate with internal engineers and external vendors to ensure on-time delivery.

You will work on complex flip-chip-BGA packages, PCBs, and system channel links for AI, HPC, 5G, and networking applications, with strong emphasis on

Qualifications

• Bachelor, Master, or PhD in EE with 7+–12+ years of experience depending on degree.
• Experience managing people and projects.
• Knowledge of signal integrity and power integrity at package/PCB/system level.

Responsibilities

• Manage 20+ concurrent package/PCB designs from planning to execution.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, risks regularly.
• Develop technical methodologies for SI/PI solutions.
• Collaborate with internal and external teams.
• Support lab measurements and hardware coordination.

Skills

People management

Project management

SI/PI knowledge

Team collaboration

Communication skills

Education

BSEE or similar field

MSEE or similar field

PhD EE or similar field

Tools

SI/PI EDA tools

Automation scripting (Python)

Job description

Broadcom is seeking an experienced SI/PI technical project manager to lead and coordinate high-speed SerDes and high-power delivery package designs for ASICs. You will manage cross‑functional teams across global sites, drive technical methodologies, and collaborate with internal engineers and external vendors to ensure on-time delivery.

You will work on complex flip-chip-BGA packages, PCBs, and system channel links for AI, HPC, 5G, and networking applications, with strong emphasis on