SI/PI Tech Project Manager

Frontdoor Defense; Colorado; On-site; USD 120,000 - 180,000; Full time

Job summary

Broadcom is seeking an experienced SI/PI Technical Project Manager to lead and coordinate high‑speed package and PCB designs from concept through production. You will work with a global R&D team on AI/HC HPC ASIC-related projects, including SerDes and power integrity challenges.

The role requires on‑site collaboration across Fort Collins/San Jose, with strong technical leadership and a track record in delivering complex high‑frequency designs.

Qualifications

• BSEE or similar field with extensive experience in SI/PI.
• Advanced degrees favored (MSEE/PhD) with 7+ years of work.
• Knowledge of SI/PI at package, PCB, and system levels.

Responsibilities

• Technical Project Management: track plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources).
• Understand team skill sets to maximize productivity and retention.
• Organize team & customer activities to keep projects on track.
• Clearly communicate plans, status, next steps and risks regularly.
• Create technical methodologies for signal and power integrity solutions.
• Understand package and PCB technologies with input from the team.
• Customer, vendor, & cross-functional collaboration.

Skills

Technical Project Management

Signal Integrity

Power Integrity

Team Coordination

Cross-functional Collaboration

Education

BSEE or equivalent

MSEE or equivalent

PhD EE or equivalent

Tools

SI/PI EDA Tools

Laboratory Equipment

Job description

SI/PI Tech Project Manager

Lead and coordinate SI/PI technical projects from concept through production for Broadcom ASIC packages

Location: Fort Collins, Colorado San Jose, California

About The Role

SI/PI Technical Project Manager

Location: Fort Collins or San Jose

Broadcom is seeking an experienced SI/PI technical project manager to assist engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR and more. In this role, you will support and develop with the engineering team(s), as well as contribute to technical methodologies, flows and technical project management.

Responsibilities:

• Technical Project Management: Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpoint
• Understand the skill sets and traits of each team member, in order to maximize productivity and retention
• Organize team & customer activities to keep projects on track
• Clearly and concisely communicate plans, status, next steps and risks on a regular basis
• Create technical methodologies for signal and power integrity solutions
• Understanding and supporting package and PCB technologies with input from team members
• Customer, vendor, & cross-functional collaboration

Education/Experience & Requirements:

• Preferred candidates have previous experience managing people and projects
• BSEE or similar field and 12+ years or MSEE or similar field and 10+ years or PhD EE or similar field and 7+ years of work experience.
• Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management, organization, and clear communication skills
• Technical understanding related to System Signal and Power Integrity development and support:
• Project Management
• Automation code development
• SI/PI EDA extractions and simulations
• System level SerDes channel results
• Lab measurements - passive and active
• Lab and measurement correlation efforts
• Lab equipment needs and management
• Package and PCB lifecycle and design flows
• How the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectively
• Design Data, including how it is created and utilized (e.g. package::.mcm, package spreadsheet, drawings (POD, Lid, Substrate))

Other Requirements:

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. This role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-design

Compensation and Benefits

The annual base salary range for this position is USD To USD. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.