SI/PI Tech Project Manager

Broadcom; San Jose (CA); Presencial; USD 180.000 - 260.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Discretionary annual bonus

Equity grants

Employee Stock Purchase Program (ESPP)

Comprehensive benefits package

Descripción de la vacante

Broadcom is seeking an experienced SI/PI technical project manager to lead and coordinate high-speed SerDes and high-power delivery package designs for ASICs. You will manage cross‑functional teams across global sites, drive technical methodologies, and collaborate with internal engineers and external vendors to ensure on-time delivery.

You will work on complex flip-chip-BGA packages, PCBs, and system channel links for AI, HPC, 5G, and networking applications, with strong emphasis on

Formación

• Bachelor, Master, or PhD in EE with 7+–12+ years of experience depending on degree.
• Experience managing people and projects.
• Knowledge of signal integrity and power integrity at package/PCB/system level.

Responsabilidades

• Manage 20+ concurrent package/PCB designs from planning to execution.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, risks regularly.
• Develop technical methodologies for SI/PI solutions.
• Collaborate with internal and external teams.
• Support lab measurements and hardware coordination.

Conocimientos

People management

Project management

SI/PI knowledge

Team collaboration

Communication skills

Educación

BSEE or similar field

MSEE or similar field

PhD EE or similar field

Herramientas

SI/PI EDA tools

Automation scripting (Python)

Descripción del empleo

Job Description

Location : Fort Collins or San Jose

Broadcom is seeking an experienced SI/PI technical project manager to assist engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR and more. In this role, you will support and develop with the engineering team(s), as well as contribute to technical methodologies, flows and technical project management.

RESPONSIBILITIES

• Technical Project Management : Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpoint
• Understand the skill sets and traits of each team member, in order to maximize productivity and retention
• Organize team & customer activities to keep projects on track
• Clearly and concisely communicate plans, status, next steps and risks on a regular basis
• Create technical methodologies for signal and power integrity solutions
• Understanding and supporting package and PCB technologies with input from team members
• Customer, vendor, & cross-functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS

• Preferred candidates have previous experience managing people and projects
• BSEE or similar field and 12+ years or MSEE or similar field and 10+ years or PhD EE or similar field and 7+ years of work experience.
• Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management, organization, and clear communication skills
• Technical understanding related to System Signal and Power Integrity development and support :
• Project Management
• Automation code development
• SI/PI EDA extractions and simulations
• System level SerDes channel results
• Lab measurements - passive and active
• Lab and measurement correlation efforts
• Lab equipment needs and management
• Package and PCB lifecycle and design flows
• How the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectively
• Design Data, including how it is created and utilized (e.g. package:: .mcm, package spreadsheet, drawings (POD, Lid, Substrate))

Other Requirements

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. This role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-design

Compensation And Benefits

The annual base salary range for this position is USD To USD

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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