Senior ASIC Package Design Engineer - High-Speed SerDes

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

401(k) with company matching

Medical/dental/vision benefits

Paid holidays

Job summary

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs. You will join a world-wide R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

Responsibilities include design, SI/PI, scheduling across multiple projects, and collaboration with internal and external teams. On-site role with a competitive compensation package and bonus/equity opportunities.

Qualifications

• Requires BSEE or similar field with 12+ years in flip-chip-BGA package design, including high-speed SerDes.
• Experience with package-level SI/PI and reliable, manufacturable designs.
• Cadence APD (Allegro) or equivalent tool experience; design automation coding is a plus.

Responsibilities

• Overall design responsibility for ASIC package designs including SI/PI, manufacturability, reliability and thermal.
• Package design of SerDes, ADC/DAC, DDR, HBM, etc.
• Manage 2+ projects simultaneously and track progress.
• Perform general flip-chip BGA package design and engineering.
• Project management and customer interface for design projects.
• Improve design team efficiency through process development and automation.

Skills

Self-management

Time-zone collaboration

Project management

Design automation

Education

BSEE or similar field

MSEE or similar field

Tools

Cadence APD Allegro

Cadence SKILL

Job description

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs. You will join a world-wide R&D team developing high-performance package designs for AI, networking, HPC, and 5G base stations.

Responsibilities include design, SI/PI, scheduling across multiple projects, and collaboration with internal and external teams. On-site role with a competitive compensation package and bonus/equity opportunities.