Senior SI/PI Engineer - Advanced 2.5D/3D Packaging

Amazon; Cupertino, Northern (CA, KY); Hybrid; USD 183,000 - 248,000; Full time

Benefits offered by this job

Health insurance

RSUs

Paid time off

Job summary

Annapurna Labs, an Amazon organization, seeks a Sr. Signal & Power Integrity Engineer to own the package-level SI/PI strategy for next-generation machine learning and data center ASICs. You will drive analysis from architecture trade-offs to design closure, working at IC-package-board interfaces.

Key responsibilities include SI/PI analysis for 2.5D/3D-IC, EMIR validation, and PDN optimization, collaborating with ASIC, board, and packaging teams to ensure performance and manufacturability.

Qualifications

• Master's degree in Electrical Engineering or related field.
• Experience in signal integrity and power integrity for packaging contexts.

Responsibilities

• Lead package-level SI/PI analysis for 2.5D, 3D-IC, fan-out, and silicon interposer/bridge architectures.
• Design and optimize package stack-ups for high-speed and power delivery performance.
• Perform high-speed channel simulations and PDN end-to-end analysis across die-to-board interfaces.

Skills

SI/PI analysis

2.5D/3D-IC packaging

PDN optimization

EMIR analysis

S-parameter extraction

Time-domain analysis

Clock distribution & jitter

Collaborative cross-functional work

Education

Master's degree in Electrical Engineering

PhD (nice to have)

Tools

Ansys RedHawk-SC 3DIC

Cadence Voltus

Job description

Annapurna Labs, an Amazon organization, seeks a Sr. Signal & Power Integrity Engineer to own the package-level SI/PI strategy for next-generation machine learning and data center ASICs. You will drive analysis from architecture trade-offs to design closure, working at IC-package-board interfaces.

Key responsibilities include SI/PI analysis for 2.5D/3D-IC, EMIR validation, and PDN optimization, collaborating with ASIC, board, and packaging teams to ensure performance and manufacturability.