Senior Semiconductor Packaging Modeling Lead - Hybrid

NVIDIA Corporation; Santa Clara (CA); Hybrid; USD 124,000 - 224,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA Corporation in Santa Clara, CA is seeking a Senior Package Modeling Engineer within the Advanced Technology Group (ATG). You will perform FEA to assess stress and thermo-mechanical behavior of advanced semiconductor packaging, contributing to roadmaps and material choices while mentoring teammates.

The role requires a strong background in FEA tools and packaging architectures, with excellent problem-solving and communication skills to drive reliable builds and collaborations across groups.

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or related field.
• 5+ years of FEA modeling/simulation experience.
• Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
• Knowledge of thermal-mechanical interactions and reliability failure modes.

Responsibilities

• Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
• Contribute to packaging technology direction and long-term roadmaps by evaluating new materials and interconnect concepts.
• Analyze material properties and their impact on package reliability.
• Establish modeling approaches, interpret results, and mentor others on package build and processes.
• Collaborate with cross-functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.

Skills

Problem-solving

Analytical skills

Communication skills

Education

MS or PhD in Mechanical Engineering, Materials Science, or related field

Tools

ANSYS

Abaqus

COMSOL

Job description

NVIDIA Corporation in Santa Clara, CA is seeking a Senior Package Modeling Engineer within the Advanced Technology Group (ATG). You will perform FEA to assess stress and thermo-mechanical behavior of advanced semiconductor packaging, contributing to roadmaps and material choices while mentoring teammates.

The role requires a strong background in FEA tools and packaging architectures, with excellent problem-solving and communication skills to drive reliable builds and collaborations across groups.