Senior Staff Thermal Engineer - Advanced Packaging

Samsung-Semiconductor; San Jose (CA); On-site; USD 189,000 - 301,000; Full time

Benefits offered by this job

4+ weeks paid time off

Fertility/adoption stipend

Medical travel support

Onsite cafe & gym

Flexible work environment

Job summary

Samsung Semiconductor seeks a Senior Staff Engineer to lead thermal simulation for advanced packaging. The role focuses on hands-on modeling, multi-physics analysis, and collaboration with cross-functional teams in a fast-paced environment in San Jose, CA. Experience with IC/chip/package thermal constraints and SIP would be ideal.

The position requires a PhD with 10+ years in industry, strong CFD tool proficiency, and excellent communication to guide design decisions and customer engagements.

Qualifications

• PhD in Mechanical Engineering, Thermal/Fluids, or related field with 10+ years of industry experience.
• Experience using CFD tools (e.g., ANSYS Icepak, Flotherm, CELSIUS) to build models and troubleshoot packaging issues.
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
• Knowledge of SiP thermal analysis and IC chip/package architectures is a plus.
• Excellent communication and collaboration skills, with cross-cultural teamwork experience.

Responsibilities

• Lead hands-on thermal modeling and analysis for semiconductor packages and advanced packaging.
• Build and analyze detailed models with CAD/CFD tools, set up boundaries, run simulations, and post-process results.
• Influence architecture, materials selection, and structural integrity under manufacturing and testing conditions.
• Analyze simulation data to improve product reliability and guide design decisions.
• Support customers from early thermal architecture studies to detailed modeling and optimization.
• Translate customer requirements into robust simulation methodologies and validation plans.
• Develop best practices and innovative solutions for semiconductor and packaging applications.
• Communicate findings through reports, presentations, and customer reviews.
• Stay abreast of advances in advanced packaging, 2.5D/3D integrations, and high-power cooling.

Skills

Thermal modeling

CFD analysis

Electronics cooling fundamentals

Packaging architectures understanding

Cross-functional collaboration

Education

PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science

Tools

ANSYS Icepak

Siemens Flotherm

CELSIUS

Job description

Samsung Semiconductor seeks a Senior Staff Engineer to lead thermal simulation for advanced packaging. The role focuses on hands-on modeling, multi-physics analysis, and collaboration with cross-functional teams in a fast-paced environment in San Jose, CA. Experience with IC/chip/package thermal constraints and SIP would be ideal.

The position requires a PhD with 10+ years in industry, strong CFD tool proficiency, and excellent communication to guide design decisions and customer engagements.