Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Absolics Inc; Covington (GA); On-site; USD 90,000 - 150,000; Full time

Benefits offered by this job

401K 6% matching

Healthcare 100% support

Life, STD, LTD 100% support

Cell phone allowance

PTO and self-development

Job summary

Absolics Inc. in Covington, GA seeks a Staff Engineer to drive advanced packaging mult physics modeling, covering mechanical and electrical co-simulation from die interconnects to buildup layers and system integration.

You will build predictive models, validate them against reliability data, and translate findings into actionable design rules for process and product teams. PhD or equivalent industry experience is preferred.

Qualifications

• Experience with FEA/thermo-mechanical and fracture analysis in multilayer stacks.
• Model interlayer stress, delamination, and cohesive-zone behavior.
• Characterize materials including dielectrics, metals, and substrates.
• Correlate simulations with SEM/CSAM and reliability data.
• Proficient in scripting with Python, MATLAB, or APDL.

Responsibilities

• Own simulation and interpretation of Multiphysics behavior across packaging architectures.
• Build and validate predictive models for mechanical and electrical performance.
• Translate simulation output into design rules for process and product teams.
• Perform FEA of interlayer stresses and reliability failure analysis.
• Correlate simulation results with physical failure analysis and reliability tests.

Skills

FEA modeling

Delamination modeling

Interface stresses

Material characterization

RDL knowledge

Failure mode analysis

Electro-thermal coupling

Packaging processes

Scripting (Python/MATLAB)

Education

PhD or equivalent industry experience

Tools

ANSYS

Abaqus

COMSOL

APDL

Job description

Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)

Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Location: Covington, GA

Job Type: Full-Time

This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.

Required Skills:

• FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
• Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
• Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates - CTE mismatch, viscoelasticity, plasticity
• Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
• Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
• Electrical performance simulation basics - signal/power integrity or coupled electro-thermal-mechanical modeling
• Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
• Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
• Ability to translate simulation results into actionable design rules for process/product engineering teams

Preferred Skills

• Experience with panel level packaging reliability prediction
• Exposure to system-level (board + package + die) co-simulation
• DOE/Statistical methods for correlating simulation with experimental reliability data
• Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics
• Experience with machine learning assisted surrogate modeling for faster design space exploration

Education:

PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics

Benefits:

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• Cell phone allowance
• PTO and self-development

$90,000 - $150,000