Senior Principal Packaging Engineer, Semiconductors

GlobalFoundries; Richardson (TX); On-site; USD 171,000 - 296,000; Full time

Job summary

GlobalFoundries is seeking a Senior Principal Packaging Engineer to define the package technology roadmap, lead advanced packaging design, and coordinate with OSAT partners for back-end assembly and packaging.

The role requires extensive experience in package technologies and architectures, and hands-on simulation tool proficiency to ensure performance, reliability, and manufacturability across automotive and industrial applications.

Qualifications

• MS or BS in EE or ME with >15 years in package design.
• Expertise in QFN, FCBGA, and WLCSP packaging architectures.
• Hands-on with Cadence, Synopsys, Ansys, and HFSS for simulations.

Responsibilities

• Design and implement packaging solutions that align with the technology roadmap.
• Evaluate materials and BOM to meet internal quality and cost targets.
• Drive cost reduction through optimized assembly flows and processes.
• Benchmark packaging technology with suppliers to advance roadmaps.
• Collaborate with silicon design, reliability, package design, and assembly teams from concept to high-volume production.
• Lead debugging and root-cause analysis for yield issues during prototyping and qualification.

Skills

Package design

Cross-functional leadership

Supplier collaboration

Education

MS/BS in EE or ME

Tools

Cadence

Synopsys

Ansys HFSS

Job description

GlobalFoundries is seeking a Senior Principal Packaging Engineer to define the package technology roadmap, lead advanced packaging design, and coordinate with OSAT partners for back-end assembly and packaging.

The role requires extensive experience in package technologies and architectures, and hands-on simulation tool proficiency to ensure performance, reliability, and manufacturability across automotive and industrial applications.