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AMD’s advanced packaging organization seeks a Principal Mechanical Engineer to shape mechanical architecture for next‑gen HPC, AI, and semiconductor products. You will lead concept definition, mechanical design, simulation, qualification, and manufacturing ramp, influencing product direction across package, server, and rack systems.
You will mentor engineers, drive CAD design and thermal‑mechanical FEA, and partner with cross‑functional teams to deliver robust cooling solutions and high‑quality
AMD’s advanced packaging organization seeks a Principal Mechanical Engineer to shape mechanical architecture for next‑gen HPC, AI, and semiconductor products. You will lead concept definition, mechanical design, simulation, qualification, and manufacturing ramp, influencing product direction across package, server, and rack systems.
You will mentor engineers, drive CAD design and thermal‑mechanical FEA, and partner with cross‑functional teams to deliver robust cooling solutions and high‑quality