Lead IC Packaging Architect

AMD; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Job summary

AMD in Austin, TX seeks a senior advanced packaging technology leader to drive packaging architectures across client, server, gaming and GPU products. You will collaborate with product design teams and partners to define roadmaps, architect processes, and set DFM/DFY guidelines while guiding cross‑geos teams.

Lead technology development from concept to qualifications, address yield and reliability challenges, and communicate progress to AMD management and ecosystem partners worldwide.

Qualifications

• Proven track record of driving technology development in semiconductor field.
• Leadership experience driving engineering teams.
• Excellent oral and written communication skills to share complex signals with partners and management.

Responsibilities

• Work with product architects in early definition stage to understand and define package architectures, roadmap
• Lead new package technology development initiatives from concept to full technology qualification
• Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
• Establish Yield roadmap and lead implementation of yield, data analytic tools as needed

Skills

Leadership experience

Communication skills

Cross-functional collaboration

Semiconductor knowledge

Education

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

Job description

AMD in Austin, TX seeks a senior advanced packaging technology leader to drive packaging architectures across client, server, gaming and GPU products. You will collaborate with product design teams and partners to define roadmaps, architect processes, and set DFM/DFY guidelines while guiding cross‑geos teams.

Lead technology development from concept to qualifications, address yield and reliability challenges, and communicate progress to AMD management and ecosystem partners worldwide.