Senior Packaging Engineer - Advanced Module Packaging

Analog Devices, Inc.; San Jose (CA); On-site; USD 130,000 - 188,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision and dental coverage

401k

Paid vacation, holidays, and sick time

Job summary

Analog Devices, Inc. seeks an experienced Packaging Engineer to lead the development and production implementation of advanced packaging solutions for module products.

You will own package development from concept to qualification and release, collaborating with design teams, suppliers, and OSATs to ensure reliability and manufacturability. You will coordinate with international partners, participate in design reviews, and occasionally travel internationally.

Qualifications

• Master’s degree in a relevant engineering field with at least 5 years of industry experience.
• Ph.D. degree preferred for advanced package development roles.
• Experience with IC package technologies, BOMs, and reliability standards.

Responsibilities

• Develop packaging solutions for new module products from design to production release.
• Collaborate with material suppliers and OSATs during new package development.
• Lead package development and drive milestones with cross-functional teams.
• Perform FMEA, DOE, and implement PCNs for process improvements.
• Create package models, drawings and documentation for production release.
• Conduct thermal and mechanical simulations to optimize package design.

Skills

FMEA

DOE

PCN

SPC

Project management

Cross-functional collaboration

Thermal simulation

Education

Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or a related field

Ph.D. degree preferred

Tools

FloTHERM

ANSYS Icepak

ANSYS Mechanical

Job description

Analog Devices, Inc. seeks an experienced Packaging Engineer to lead the development and production implementation of advanced packaging solutions for module products.

You will own package development from concept to qualification and release, collaborating with design teams, suppliers, and OSATs to ensure reliability and manufacturability. You will coordinate with international partners, participate in design reviews, and occasionally travel internationally.