Senior RF IC Packaging Engineer for MM-Wave SoCs

Amazon Inc.; San Diego (CA); On-site; USD 154,000 - 215,000; Full time

Benefits offered by this job

Health insurance

RSU grants

401(k) matching

Job summary

Amazon Kuiper Manufacturing Enterprises LLC is seeking an IC Packaging Design Engineer to design mm-wave package solutions for beamforming SoCs. You will drive floorplanning, bump maps, and vendor collaboration to optimize power and performance.

You will set up 3D EM simulations, analyze SI, and work with thermal teams to ensure reliability in high-performance packaging. A strong RF background and volume-production experience are required.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of RF design experience.
• Proven track record of products going to volume production.
• Experience with RF communication systems.

Responsibilities

• Collaborate with digital design and RF chip designers to define floorplans and ball maps.
• Work with package vendors on stack-ups, materials selection, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types (FCBGA, FCCSP, WLCSP, QFN).
• Set up and run 3D electromagnetic simulations of package+PCB to verify designs.
• Perform signal integrity checks and model packages to identify issues like crosstalk.

Skills

RF design

S-parameters

Power integrity

High-speed interfaces

Thermal analysis

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Communications Engineering

Tools

HFSS

Momentum

Job description

Amazon Kuiper Manufacturing Enterprises LLC is seeking an IC Packaging Design Engineer to design mm-wave package solutions for beamforming SoCs. You will drive floorplanning, bump maps, and vendor collaboration to optimize power and performance.

You will set up 3D EM simulations, analyze SI, and work with thermal teams to ensure reliability in high-performance packaging. A strong RF background and volume-production experience are required.