RF Packaging Design Engineer for mm-Wave ICs

Amazon; San Diego (CA); On-site; USD 136,000 - 184,000; Full time

Job summary

Amazon is seeking an IC Packaging Design Engineer for its Leo initiative to design power-optimized packaging for mm-wave SoCs and front-end modules in a high-performance environment.

You will collaborate with cross-disciplinary teams and vendors, drive floorplanning, and run 3D EM simulations to ensure optimal performance and reliability of complex packages. The role emphasizes cross-functional teamwork and innovation.

Qualifications

• Bachelor's degree in Electrical Engineering or a related field.
• 5+ years of experience in RF design, preferably in an advanced node.
• Proven track record where products have gone to volume production.
• Experience with RF communication systems.

Responsibilities

• Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Set up and run 3D electromagnetic simulations of package + PCB to verify designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design to accelerate iterations.

Skills

RF design

Package design

Power integrity

High-speed routing

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree in Electrical/Communications Engineering

Tools

HFSS

Momentum

Job description

Amazon is seeking an IC Packaging Design Engineer for its Leo initiative to design power-optimized packaging for mm-wave SoCs and front-end modules in a high-performance environment.

You will collaborate with cross-disciplinary teams and vendors, drive floorplanning, and run 3D EM simulations to ensure optimal performance and reliability of complex packages. The role emphasizes cross-functional teamwork and innovation.